Standard Rigid PCB
Multi-layer FR4 boards from prototype through high-volume production. The bread-and-butter of our facilities.
Up to 24 Layers
Capabilities
Engineering excellence at every layer.
From single-layer prototypes to 24-layer high-density interconnects , rigid, flex, rigid-flex, RF, and metal clad. Real specifications, real tolerances, real-world performance.
1, 24 layers
Layer Count
0.15, 4.7 mm
Board Thickness
14:1
Max Aspect Ratio
1200×600 mm
Max Board Size
9 finishes
Surface Treatments
What We Build
Five specialized facilities, one engineering team
Each of our manufacturing plants is purpose-built for a specific production type , rigid quick-turn, mass production & HDI, flex and rigid-flex, medium volume, and metal clad. One supplier, the right facility for every project.
High-Frequency / RF
Arlon and Taconic substrates engineered for signal integrity at GHz frequencies , telecom, radar, satellite.
Materials Arlon · Taconic
Metal Clad / Aluminum
Aluminum and copper base boards for high-power LED lighting and thermal management applications.
Cu thickness Up to 8 oz outer
Flex PCB
Polyimide-based flexible circuits, 1, 10 layers, with adhesive and adhesiveless construction options.
Up to 10 Layers
Rigid-Flex PCB
Combined rigid and flexible sections in a single board , eliminating connectors, reducing assembly cost and failure points.
Min flex bend Custom Engineered
HDI / Microvia
High-density interconnects with blind & buried vias, fine-pitch traces, and microvia stacking for compact designs.
Min via 0.1 mm (4 mil)
Technical Specifications
Real specs, no asterisks
The numbers below are our standard volume capabilities. Pushing limits? Our engineering team will validate any spec on a per-project basis.
Layer Count & Thickness
- Layer count (rigid)1, 24 layers
- Layer count (flex)1, 10 layers
- Final board thickness0.15, 4.7 mm
- Min core thickness0.05 mm (2 mil)
- Outer copper thickness≤ 8 oz
- Inner copper thickness≤ 4 oz
- Max aspect ratio14:1
Materials
- FR4 standardShengyi
- High-Frequency / RFArlon · Taconic
- Metal CladVentec · Boyu
- Polyimide (Flex)Shengyi · Thinflex · Taiflex
- High TG / Aluminum / Copper baseAvailable
- Bonding filmHF flame-resistant
Holes & Vias
- Min PTH hole0.10 mm (4 mil)
- Min blind via0.10 mm (4 mil)
- Min flex drill0.15 mm
- PTH tolerance±0.05 mm
- NPTH tolerance±0.05 mm
- Hole position tolerance±0.05 mm
- Counter sunk hole90° & 180°
Tolerances & Registration
- Profile dimension±0.075 mm
- Layer-to-layer (4 layers)±0.05 mm
- Layer-to-layer (8, 10)±0.12 mm
- Layer-to-layer (18, 24)±0.20 mm
- V-cut tolerance±0.075 mm
- Warpage (balanced)0.5%
- Etching tolerance±10, 20%
Board Sizes
- Max normal700 × 600 mm
- Max overlong1200 × 600 mm
- Min flex panel5 × 8 mm
- Max flex panel500 × 620 mm
- V-cut board thickness0.30, 3.2 mm
- Gold finger angles20° · 30° · 45°
Solder Mask & Legend
- Min mask bridge (≤2 oz)3 mil (green)
- Min mask bridge (3, 4 oz)4 mil (green)
- Min legend height20 mil
- Min legend width16 mil
- Min legend line-width3 mil
- Solder mask plug hole0.8 mm finished
- Mask colorsGreen · Black · White · Yellow · Red · Blue
Trace Width & Spacing Calculator
Select a base copper weight to see our minimum trace width and spacing capabilities (before compensation, outer layer with standard ½ oz plating).
Min trace width
3.0 mil
~0.076 mm
Min spacing
3.5 mil
~0.089 mm
Surface Finishes
Nine surface treatments, matched to your application
Different end uses demand different finishes. Our facilities run all nine in-house , no second-source pickup, no logistics juggling.
HASL
Hot Air Solder Leveling
Lead-based finish , robust, economical, excellent solderability for through-hole and standard SMT applications.
LF-HASL
Lead-Free HASL
RoHS-compliant variant of HASL using SnCu or SnAgCu alloy. Same robustness, no lead.
ENIG
Immersion Gold
Electroless nickel + immersion gold. Flat surface, long shelf life, ideal for fine-pitch BGAs and gold-bonded wire.
I-Tin
Immersion Tin
Lead-free planar finish for press-fit applications and fine-pitch SMT. Cost-effective alternative to ENIG.
I-Silver
Immersion Silver
Excellent electrical conductivity and solderability. Common in high-frequency RF and aluminum-bonded designs.
OSP
Organic Solderability Preservative
Thin organic coating protecting copper for SMT assembly. Lead-free, low-cost, environmentally friendly.
ENEPIG
Electroless Nickel + Pd + Au
Premium finish for wire bonding and high-reliability applications. Eliminates the "black pad" failure mode of ENIG.
Hard Gold
Electrolytic Hard Gold
Used for gold fingers, edge connectors, and contact pads requiring high abrasion resistance.
Carbon
Carbon Ink
Conductive carbon coating for keypad contacts, jumpers, and shielded surfaces. Cost-effective for specific use cases.
Quality Control
Every board, tested every way that matters
Twelve in-house testing methods , from optical inspection to thermal stress to bond strength. The numbers we publish are numbers we measure.
AOI Inspection
100% E-Test
Impedance Test
Inductance Test
Metallographic Analysis
Plating Thickness
Thermal Stress Test
DVW Test
Plating Adhesion
Bond Strength
Surface Peelable
Final Finish Thickness
Spec Sheets
Download the full specifications
Everything above plus the full process capability map for engineering review.
Standard PCB Capabilities
Full technical capability sheet , rigid boards, materials, tolerances, and process specs. Updated 03/2026.
Rigid-Flex & FPC Capabilities
Full rigid-flex and flexible PCB process capability map , flex layer specs, bending radius, lamination, and stiffener options.